- 主要功能：柔性半导体系统级封装领域的工艺设备，用于芯片贴片
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- 主要技术指标：Dynamic XYZ theta servo motors Datacon pattern recognition system with edge, pattern, and ink-dot recognition Programmable lighting systems with RGB light (partial) Machine capability 10 µm @ 3s CMOS substrate camera/optics/illumination Upward-looking camera Wafer camera Transport system Bondforce sensor and Mini-BMC kit Theta axis rotary bond-head, theta range: 0° - 360°, with 0.0045° resolution Teach-in programming, menu-driven by integrated ETX- based industry PC and Linux GUI Documentation: CD-ROM ( English) 1 application setup included for buy-off
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- 主要学科领域：信息与系统科学相关工程与技术,电子与通信技术,自然科学相关工程与技术
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- 服务内容：柔性半导体系统级封装领域的工艺设备，用于芯片贴片
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设备简介
2023-02-17
